Worldwide leading developer of advanced wireless technologies, Qualcomm Incorporated, recently announced that it has started the sampling of the world’s first chipsets for dual-carrier HSPA+ and multi-mode 3G /LTE. According to the company, the new Mobile Data Modem (MDM) MDM8220 solution that comes with Dual-carrier High-Speed Packet Access Plus (DC-HSPA+) is the first of the kind in industry, while the MDM9200 and the MDM9600 chipsets are the first multi-mode 3G/Long Term Evolution (LTE) chipsets.
The company also stated that the new chipsets showed the advancements that had been made in the process of deploying two next-generation network technologies, which should offer increased data capabilities to any mobile phone. Qualcomm is currently working with a variety of operators, infrastructure vendors and handset makers for the roll-out of the new technologies, and it already conducts interoperability testing around the world. According to the company, the commercial availability of the first devices based on the new MDM solutions should occur sometime in late 2010.
“Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE. We are pleased to be working with so many industry… (read more)
